The ESS-108 is specifically designed to remove epoxy compound spills that remain on the surface of the product during injection molding of lead frames. ESS-108 can remove epoxy compound overflow and transparent colloid at room temperature. In the process of removing epoxides, ESS-108 does not attack the metal materials of the lead frame such as copper and alloys, but merely removes the oxide on its surface.
Non-toxic, does not burn and explode. Avoid contact with eyes, skin and clothing. Wear protective clothing, rubber gloves and goggles and store in a cool, dry and ventilated area.
Suitable for all EMC.
Does not attack metal substrates.